Methods and systems for computer aided design of 3d integrated circuits

ABSTRACT

Methods and systems for generating and verifying circuit layouts from computer-aided design tools for vertically integrated, three-dimensional integrated circuits are disclosed. In one instance, a 3-D technology file of these teachings is obtained by providing an identifier for two or more circuit levels, providing for each one of the two or more circuit levels an identifier for a 2-D technology file corresponding to each of the one or more circuit levels and providing a file structure including the two or more circuit levels and each identifier, corresponding to each one of the one or more circuit levels, for the 2-D technology file corresponding to each one of the two or more circuit levels. Other embodiments are disclosed.

CROSS-REFERENCE TO RELATED APPLICATIONS

This application is a continuation of U.S. patent application Ser. No.13/585,412 filed on Aug. 14, 2012 entitled “METHODS AND SYSTEMS FORCOMPUTER AIDED DESIGN OF 3D INTEGRATED CIRCUITS”, which is acontinuation of U.S. patent application Ser. No. 13/218,581 filed Aug.26, 2011 entitled “METHODS AND SYSTEMS FOR COMPUTER AIDED DESIGN OF 3DINTEGRATED CIRCUITS”, which is a continuation of U.S. patent applicationSer. No. 12/233,260 filed Sep. 18, 2008 entitled “METHODS AND SYSTEMSFOR COMPUTER AIDED DESIGN OF 3D INTEGRATED CIRCUITS”, which is adivisional of U.S. patent application Ser. No. 11/485,883 filed Jul. 13,2006 entitled “METHODS AND SYSTEMS FOR COMPUTER AIDED DESIGN OF 3DINTEGRATED CIRCUITS”, which in turn claims priority of U.S. ProvisionalApplication 60/702,364 entitled “METHODS AND SYSTEMS FOR COMPUTER AIDEDDESIGN OF 3D INTEGRATED CIRCUITS”, filed on Jul. 26, 2005, all of whichare incorporated by reference herein in their entirety.

STATEMENT REGARDING FEDERALLY SPONSORED RESEARCH OR DEVELOPMENT

This invention was made partially with U.S. Government support from theDefense Advanced Research Projects Agency under Contract No.DAAH01-03-C-R167. The U.S. Government has certain rights in theinvention.

BACKGROUND

Ever since the planar integrated circuit was invented independently byRobert Noyce and Jack Kilby in 1959, designers have sought methods toautomate the process of creating the mask artwork necessary forphotolithography. Originally circuit designers had to manually createaccurate scale drawings of a circuit layout and separate these into maskoverlays. By the late 1960's, as described in the document, “MasksAutomatically,” at the Smithsonian National Museum of American History,Science Service, CD 1967051, E&MP 68.001, computer-aided design (CAD)methods had been developed so that designers could provide a circuitdescription in a symbolic language to a computer program that wouldtrace the mask layers on a light table. By the mid-1970's as computershad developed to the point where bit-mapped graphics could be renderedin real-time, and as integrated circuit densities increased into thethousands of devices per chip, automated graphical layout programs beganto appear that permitted the designer to directly “draw” the circuitartwork on a computer monitor using interactive graphical tools. Some ofthese programs are described in the papers “An Interactive GraphicsSystem for the Design of Integrated Circuits,” presented by Infante, B.,et al.; and “ICARUS: An Interactive Integrated Circuit Layout Program,”presented by Fairbairn, D. G., et al, at the 15th Conference on DesignAutomation in June 1978.

By the end of the 1970's, many different fabrication processes, ortechnologies, had been developed by different manufacturers. Theearliest layout tools incorporated functions relevant to a specificfabrication process within the code, which meant that the program neededto be modified when the process changed. It quickly became apparent thattechnology-independence was a necessary characteristic of any programfor integrated circuit layout. At the 20th Conference on DesignAutomation in 1983, papers by Heilweil, M. F., “Technology Rules—TheOther Side of Technology Dependent Code,” and Von Ehr, G. J., “PositionPaper: Role of Technology Design Rules in Design Automation,” discussedthe types of information that needed to be stored in an externaltechnology file.

By the mid-1980's almost all integrated circuit layout programs hadadopted the method of storing technology-dependent information in anexternal technology file. Some of these programs are described in “CADSystems for IC Design,” by Daniel et al, published in the IEEETransactions on Computer-Aided Design of Integrated Circuits andSystems, vol. 1, January 1982, pp. 2-12; “Lyra: A New Approach toGeometric Layout Rule Checking,” by Arnold, M. H. et al, presented atthe 19th Conference on Design Automation in June 1982; “Magic: A VLSILayout System,” presented by Ousterhout, J. K., at the 21st Conferenceon Design Automation in June 1984; and in a further paper by Ousterhout,J. K., “The User Interface and Implementation of an IC Layout Editor,”published in the IEEE Transactions on Computer-Aided Design ofIntegrated Circuits and Systems, vol. 3, July 1984.

At the 22nd Conference on Design Automation in 1985, Smith, P. et al,presented a general framework for a canonical technology file structurein the paper, “The VIVID System Approach to Technology Independence: theMaster Technology File System”. The master technology file containsinformation concerning the design layers that may be drawn, as well asthe graphical stipple patterns and colors for rendering thecorresponding shapes on a computer monitor display. It also incorporateselectrical and physical design rules to specify electrical connectivitybetween layers or to enforce constraints such as minimum width orspacing rules. While the exact format and contents of the technologyfile as implemented today in any given CAD program may vary greatly,this basic structure has become well established.

A second innovation in the development of CAD tools for integratedcircuit layout, which has also become a standard feature, is the abilityto create hierarchical structures and to implement standard celllibraries. An early example of a CAD system implementing cellhierarchies was presented by Edmondson, T. H., et al, “A Low CostHierarchical System for VLSI Layout and Verification,” at the 18thConference on Design Automation in June 1981. In a hierarchical design,“leaf’ cells representing simple combinations of gates or interconnectwiring are created as independent structures. A more complex cell can beformed by instantiating combinations of leaf cells in differentpositions and orientations. Not only is hierarchical design moreefficient in terms of memory storage than a “flat” design, but it alsopermits the use of symbolic notation to represent the leaf cells in alibrary. This feature further leads to the possibility of automaticallygenerating the layout from schematic or behavioral descriptions withminimal human intervention required to finalize the artwork beforefabrication. U.S. Pat. No. 4,612,618 describes a canonical approach forthe hierarchical, computerized design of integrated circuits.

More recently, as the need for increased circuit densities andfunctionalities have begun to outpace the ability of two-dimensionalplanar fabrication processes to produce these economically, attentionhas been turning to the possibilities offered by three-dimensionalintegration. Herein below, the term “three-dimensional integratedcircuit”, or 3-D IC, refers to a circuit in which active devices layersare stacked on top of one another and electrically interconnected. Thedistinction is primarily related to the stacking of active devices thatare formed in a semiconductor substrate. Current planar processes areinherently “three-dimensional” in that they are composed of devices uponwhich are formed one or more layers of dielectric and conductingmaterials. The text, Three-Dimensional Integrated Circuit Layout(Distinguished Dissertations in Computer Science), edited by Harter, A.C., Cambridge University Press, November, 1991, uses the term todescribe the multi-layer metallization used in the planar CMOS process,and not a multi-layer device process. Herein below, a three-dimensionalintegrated circuit is one in which active devices, such as transistorsand diodes, may be arranged both vertically and laterally.

The concept of producing three-dimensional integrated circuits toincrease device density is not new. U.S. Pat. No. 4,272,880, issued in1981 describes a method for fabricating multi-layer integrated circuitsin a Silicon-on-Sapphire process. U.S. Pat. No. 4,489,478, issued in1984 describes a method for forming a secondary semiconductor layer ontop of a first with an interposing dielectric layer. However, it is onlyrecently that manufacturing economics have spurred a renewed interestboth in 3-D technology development and in 3-D circuit design. A plethoraof patents have been issued in the last five years on differentmethodologies and approaches for 3-D integrated circuit fabrication.

U.S. Pat. No. 6,355,501 describes a method for creating 3-D circuits bystacking and aligning Silicon-on-Insulator (SOI) chips with aninterposing metal layer to form interconnects. U.S. Pat. No. 6,465,892describes a method for routing metal interconnect between verticallyaligned circuit layers by boring through the substrates. U.S. Pat. No.6,525,415 describes another method of stacking and aligningsemiconductor substrates with embedded interconnect layers. U.S. Pat.No. 6,727,517 describes a vertical integration approach that involvesgrowing semiconductor crystal grains by metal-induced lateralcrystallization following patterning of amorphous silicon on depositedmetal strips. U.S. Pat. No. 6,875,671 describes an approach utilizing asubstrate with layers of predetermined weak and strong bond regions.Deconstructed layers of silicon circuits are fabricated on the weak bondregions and are then peeled off to form multi-layer circuits. U.S. Pat.No. 6,881,994 describes a monolithic fabrication methodology forfabricating a three-dimensional array of charge-storage devices. U.S.Pat. No. 6,943,067 describes yet another SOI-based fabrication approachincorporating a low temperature bonding method and backside/substratecontact process.

Other 3-D fabrication approaches in development have been described inthe scientific literature, such as Mcllrath, L. G. et al, “Architecturefor Low-Power Real-Time Image Analysis using 3D Silicon Technology,”Proceedings of SPIE AeroSense 1998, vol. 3362, August 1998; Subramanian,V., et al, “Low-Leakage Germanium-Seeded Laterally-CrystallizedSingle-Grain 100-nm TFT's for Vertical Integration Applications,” IEEEElectron Device Letters, vol. 20, no. 7, July 1999; Banerjee, K., et al,“3-D ICs: A Novel Chip Design for Improving DeepSubmicrometerInterconnect Performance and Systems-on-Chip Integration,” Proceedingsof the IEEE, vol. 89, no. 5, May 2001; Burns, J. A., et al,“Three-Dimensional Integrated Circuits for Low-Power, High BandwidthSystems on a Chip,” Proceedings of the 2001 IEEE International SolidState Circuits Conference, February 2001; and Patti, R., “3D: Design toVolume—A Look at Various 3D Applications, Their Designs, and UltimateSilicon Results,” 3D Architectures for Semiconductor Integration andPackaging Symposium, June 2005.

Because technologies for fabricating 3-D integrated circuits have notyet become firmly established, relatively few designers have had theopportunity to develop 3-D circuits for fabrication. For the most part,the designers that have needed to create mask artwork for 3-D circuitshave done so by implementing ad hoc workarounds within conventional CADprograms for 2-D layout. One possible workaround is to manually aligncells for different stack levels by creating pseudo-3D cells, that is,having leaf cells that are the circuits for each layer. This method doesnot allow design rule checks or netlist extraction, however. Anothermethod is to replicate the design layer names contained in the 2-Dtechnology file for each of the levels in the stack. This methodrequires that special rules be created to specify inter-levelinterconnects. It also results in multiple replications of theelectrical and physical design rules for each design layer and is veryinefficient in terms of memory usage. The text, Three-DimensionalIntegrated Circuit Layout (Distinguished Dissertations in ComputerScience), by Harter, A. C., Cambridge University Press, November, 1991,describes some primitive methods for creating topologies for wiringstandard cells on multiple layers, but does not provide direct methodsfor efficiently creating the mask artwork.

Several examples of fabricated 3-D circuits have been described in theliterature. Koyanagi, M., et al, “Neuromorphic vision chip fabricatedusing three-dimensional integration technology,” Proceedings of the 2001IEEE International Solid State Circuits Conference, February 2001,describes a 3-D IC containing a photoreceptor layer and two neuromorphiclayers that perform operations similar to retinal bipolar and ganglioncells.

In the previously cited reference, Burns, J. A., et al,“Three-Dimensional Integrated Circuits for Low-Power, High BandwidthSystems on a Chip,” a 3-D IC is described that has a photodiode on onelayer coupled to an analog-to-digital (AID) conversion circuit on asecond layer. U.S. Pat. No. 6,741,198 describes a generalizedarchitecture for a three-layer digital imaging chip incorporating aphotosensor, an A/D converter, and a digital signal processing circuit,all realized on separate circuit layers.

A 3-D radio frequency (RF) transceiver was presented by Qun, G., et al,“Three-dimensional circuit integration based on self-synchronizedRF-interconnect using capacitive coupling,” 2004 Symposium on VLSITechnology, June 2004. In this device the vertical interconnects arerealized through capacitive coupling of elements on separate layers. InKoob, J. C., et al, “Design of a 3D Fully-Depleted SOI ComputationalRAM,” IEEE Transactions on Very Large Scale Integration Systems, vol.13, no. 3, March 2005, a design is presented for a modular 3-Dintegrated processor-in-memory stack. The key feature of this design isthat the same photolithography masks for each circuit level can bere-used. A hierarchical bus evaluation network senses how many layersare in the stack and generates addresses accordingly. Patti, R., “3D:Design to Volume—A Look at Various 3D Applications, Their Designs, andUltimate Silicon Results,” 3D Architectures for SemiconductorIntegration and Packaging Symposium, June 2005, describes another 3-Dprocessor-in-memory device in which the memory elements are embedded ina circuit below the processor units.

The primary feature that is common to all of these designs is that thecell structures requiring 3-D interconnections are relatively simple. Inthe 3-D imaging chips, a single inter-layer interconnect is used toconnect the photoreceptor to the active pixel circuit on the layerbelow, and only one or two 3-D interconnects are required to connect theactive pixel circuit to the processing layer below it. In the 3-Dintegrated RF circuit, physical interconnection structures are notrequired. The processor-in-memory 3-D circuits are each composed ofarrays of identical processing elements. Only the unit 3-D cells foreach element needed to be laid out carefully and manually checked.Because of this simplicity, it was feasible, albeit time consuming, forthe designers to create the mask artwork for the individual circuitlayers by ad hoc methods with standard 2-D layout CAD tools.

It should be clear from this discussion that better, more automated CADsystems and methods are required for 3-D IC design before complexcomponents can be realized. Many researchers are now investigating 3-Dtopologies at a higher level of abstraction than the physical layout.Routing methods for 3-D field programmable gate arrays (FPGAs) areanalyzed by Hung, W. N. N., et al, “Routability checking forthree-dimensional architectures,” IEEE Transactions on Very Large ScaleIntegration Systems, Vol. 12, No. 12, December 2004; and Manimegalai,R., “Placement and routing for 3D-FPGAs using reinforcement learning andsupport vector machines,” 18th International Conference on VLSI Design,2005. In order to reduce these systems to practice, automated tools forartwork creation and verification will have to be put in place.

In the paper by Mcllrath, L. G., “High Performance, Low PowerThree-Dimensional Integrated Circuits for Next Generation Technologies,”Proceedings 2002 International Conference on Solid State Devices andMaterials, Nagoya, Japan, September 2002, the requirements of anautomated 3-D CAD program for generating multi-layer layouts werespecified. These requirements include the need to incorporate multipletechnology files for combining the technology-dependent information fordifferent processes and the need to implement a hierarchical 3-D cellstructure that can handle both vertical and lateral dependencies.

SUMMARY

In one embodiment, a 3-D technology file of these teachings is obtainedby providing an identifier for two or more circuit levels, providing foreach one of the two or more circuit levels identifier for a 2-Dtechnology file corresponding to each of the one are more circuit levelsand providing a file structure including the two or more circuit levelsand each identifier, corresponding to each one of the to a more circuitlevels, for the 2-D technology file corresponding to each one of the twoor more circuit fails.

In another, embodiment, a 3-D cell structure of these teachings is a 3-Dcell data structure including a root data structure having a root nodedata object, the root node data object identifying a 3-D structure and anumber of branch reference data objects.

For a better understanding of the present teachings, together with otherand further needs thereof, reference is made to the accompanyingdrawings and detailed description and its scope will be pointed out inthe appended claims.

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1 illustrates one method of creating a 2-layer 3-D integratedcircuit from two separately fabricated semiconductor dice according toprior art;

FIG. 2 is a block diagram outlining the components of a technology fileas used by CAD programs for 2-D integrated circuit design according toprior art;

FIG. 3 depicts multiple wafers fabricated with different processtechnologies to be assembled into a 3-D integrated circuit;

FIG. 4 is a block diagram illustrating the components of a 3-Dintegrated circuit composed of N circuit levels;

FIG. 5 is a block diagram outlining the major sections of an embodimentof a 3-D technology file according to these teachings;

FIG. 6 a is a block diagram illustrating the components of the CircuitLevels/Technologies Section in one embodiment of a 3-D technology fileaccording to these teachings;

FIG. 6 b is a block diagram illustrating the components of the BondLayers Section in one embodiment of a 3-D technology file according tothese teachings;

FIG. 6 c is a block diagram illustrating the components of the 3-D LayerDefinitions Section in one embodiment of a 3-D technology file accordingto these teachings;

FIG. 6 d is a block diagram illustrating the components of the 3-DDesign Rules Section in one embodiment of a 3-D technology fileaccording to these teachings;

FIG. 6 e is a block diagram illustrating the components of the 3-DElectrical Rules Section in one embodiment of a 3-D technology fileaccording to these teachings;

FIG. 6 f is a flowchart representation of an embodiment of the method ofthese teachings for obtaining a 3-D technology file;

FIG. 6 g is a block diagram of an embodiment of a system forimplementing the methods and data structures according to theseteachings;

FIG. 7 is a block diagram illustrating the components of a hierarchical2-D layout cell according to prior art;

FIG. 8 is a block diagram illustrating the components of a hierarchical3-D layout cell according to these teachings;

FIG. 9 is a block diagram illustrating one embodiment of the DrawnGeometry data structure for a 3-D layout cell;

FIG. 10 illustrates a unit 3-D cell having geometry on three circuitlevels and a 3-D hierarchical cell containing an arrangement of said 3-Dunit cells;

FIG. 11 is a block diagram depicting initial steps in the design processof a 3-D integrated circuit and containing illustrations of cellscreated in the design database;

FIG. 12 is a block diagram depicting further detail in the designprocess of FIG. 11 according to prior art, in which 2-D logic cells areadded to one circuit level of the 3-D integrated circuit, and containingillustrations of cells created in the design database;

FIG. 13 illustrates diagrammatically the implicit 2-D hierarchical cellrepresenting the projection of the 3-D hierarchical cell of FIG. 8 ontoone circuit level;

FIG. 14 illustrates diagrammatically the implicit 2-D hierarchical cellsrepresenting the projections of the 3-D hierarchical cell of FIG. 10onto its three circuit levels;

FIG. 15 is a block diagram depicting further detail in the designprocess of FIG. 11 according to the present invention, in which 2-Dlogic cells are added to one circuit level of the 3-D integratedcircuit, and containing illustrations of cells created in the designdatabase;

FIG. 16 a is a block diagram illustrating one embodiment of ahierarchical tree structure of a 3-D integrated circuit containing aschildren one instance of another 3-D hierarchical cell and one instanceof a 2-D hierarchical cell, the latter containing a child that is a 2-Dcircuit level projection of its sibling 3-D hierarchical cell;

FIG. 16 b is a block diagram illustrating one embodiment of ahierarchical tree structure of a 3-D integrated circuit containing onechild instance of another 3-D hierarchical cell, which itself containsone child instance of a 2-D hierarchical cell, the latter containing achild that is a 2-D circuit level projection of its parent 3-Dhierarchical cell;

FIG. 17 a illustrates a prototype for one embodiment of a user interfacemenu to create a new layout cell in one embodiment of an automateddesign program for 3-D integrated circuit;

FIG. 17 b illustrates a prototype for one embodiment of a user interfacemenu to select the drawing level for a 3-D layout cell in one embodimentof an automated design program for 3-D integrated circuit; and

FIG. 17 c illustrates a prototype for one embodiment of a user interfacemenu to instantiate a 2-D child cell within a 3-D hierarchical cell, orto instantiate a 2-D child cell representing the circuit levelprojection of a 3-D cell within a 2-D hierarchical cell, in oneembodiment of an automated design program for 3-D integrated circuit.

DETAILED DESCRIPTION

Methods and systems for generating and verifying circuit layouts fromcomputer-aided design tools for vertically integrated, three-dimensionalintegrated circuits are disclosed herein below.

A three-dimensional, or 3-D, integrated circuit is one comprisingmultiple levels of semiconductor substrates, each containing activedevices therein, in which the different substrates are verticallystacked and electrical interconnections may be made between circuitcomponents on different levels. A significant innovation of emerging 3-Dintegration technology is that the vertical interconnections may beplaced anywhere within the area of any circuit level. This featureprovides for a tremendous improvement in device density, but it alsoadds new constraints for the designer, who should ensure thatappropriate design rules are met and that the 3-D physical circuit willfunction according to the specifications of the logic design.

The ability to provide arbitrarily placed vertical interconnectionsmeans that basic functional blocks may be composed from 3-dimensionalunit cells in a design library. A computer-aided design program shouldbe able to efficiently place such cells in an overall chip layout alongwith 2-D cells assigned to a given circuit level and ensure that allphysical and electrical design rules are met.

Embodiments of the methods of the present invention permit theimplementation within an integrated circuit layout program of allfunctions necessary to design the mask artwork for a 3-D integratedcircuit. The embodiments disclosed include a new hierarchical structurefor a 3-D technology file that describes to the CAD program theessential aspects of the 3-D integration process. The hierarchical 3-Dtechnology file assigns a 2-D technology to each circuit layer andpermits indexing the 2-D technology-dependent information relative tothe circuit layer, so that there is no need to duplicate thisinformation. This structure permits existing 2-D technology files,whether created by the user or supplied in a foundry design kit, to beused without modification in the 3-D layout design program.

Embodiments of the data structure of this invention include a datastructure for a 3-D hierarchical layout cell that permits inclusion ofmask artwork for 3-D design layers as well as for 2-D design layers onspecific levels at the top level of the hierarchy. Within the 3-Dhierarchical cell, both 3-D and 2-D child sub-cells may be instantiated,the latter after specifying the circuit level to which they areassigned. Substantially no information regarding the level assignment ismaintained internally within a 2-D cell until it is instantiated into a3-D parent. In this manner standard cell libraries containing basiclogic cells for 2-D design may be used without modification. Furthermorethe morphology of the 3-D integrated circuit may be modified, either byadding circuit levels or by changing the stacking order of the circuitlevels, without modification to the basic library.

A feature of the embodiment of the 3-D hierarchical tree organizationdisclosed below is a method to access a 3-D hierarchical cell byreference to its projection onto a single circuit level. In this mannera 2-D cell may instantiate a 3-D circuit level projection as a childsub-cell without creating a cycle in the tree structure. It is notedthat once such a projection is instantiated within a 2-D cell, the celldoes contain information related to a given circuit level and thereaftercannot be instantiated as a child of a 3-D parent at a different level.

Methods and systems to exercise the data structures created by insertionof the data structure embodiments into prior art CAD programs forintegrated circuit layout can be readily incorporated by adding ormodifying user interfaces to provide additional information on circuitlevel placement. It should be noted that existing prior art verificationmethods for design rule checking (DRC) and layout vs. schematic (LVS)comparison may be readily adapted to accommodate the 3-D data structuresdescribed by incorporating appropriate methods to reference the fieldsincluded therein.

Referring to FIG. 1, there is diagrammatically illustrated one manner ofassembling a 3D integrated circuit from two individually fabricatedwafers. On one wafer is patterned a first circuit (100), and on theother wafer is patterned a second circuit (110). The substrate (120) ofthe second circuit is thinned to a minimal thickness and the secondcircuit is then overlaid and bonded to the first circuit by means of anintervening bonding material (130). Subsequently, an opening is etchedthrough the upper circuit layer and filled with metal to electricallyconnect the circuits (100) and (110), forming a 3-D via (140). Toestablish the terminology that will be employed in the description, theterm “circuit level” will be used to refer to a planar arrangement ofdevices formed in the same semiconductor substrate, and the term “bondlayer” will be used to refer to all materials, whether explicitly drawnin the layout or not, added between the circuit levels during the 3-Dstacking process. A “3-D via” is any structure or combination ofmaterials that creates an electrical connection between materials ondifferent circuit levels. This terminology will be employed whether the3-D integration process involves the steps depicted in FIG. 1, or if itinvolves monolithic growth of multiple vertically arranged substrates,or if it uses any of the previously enumerated 3-D fabrication methods.

A conventional 2-D technology file will contain certaintechnology-dependent information that describes to a CAD program rulesand methods for generating and validating a circuit layout for the givenprocess. The primary elements of a conventional 2-D technology file arediagrammatically depicted in FIG. 2.

The Units Section (200) defines the units of measure on the layout grid,for example, micrometers or mils ( 1/1000′h inch), and also the minimumgrid resolution with which geometric shapes may be drawn. The minimumgrid resolution is determined by the minimum resolvable feature size ofthe fabrication process. Drawing shapes smaller than this limit not onlyhas no purpose, because the shapes cannot be reproduced on thefabricated circuit, but also increases the amount of off-line memoryrequired for storing the mask data.

The Layer Definitions Section (210) describes the abstract design typesthat may be drawn.

The Design Rules Section (220) provides a set of geometric rules thatshould be followed by the designer in order to ensure proper functioningof the circuit. These rules are imposed by the foundry and specifyconstraints on the drawn shapes such as minimum allowed widths andspacing between geometry of the same or different layers.

The Electrical Rules Section (230) describes how the design layersinteract electrically and combine to form devices. These rules arenecessary in order to extract an electrical netlist from the layout andverify that it corresponds to its schematic description.

The Mask Output Rules Section (240) specifies how to map shapes drawn asabstract design layers to shapes on physical mask layers.

A 2-D technology file will always contain a Layers Definition Section,although it need not contain information in any of the other sections,and it may contain sections not listed above.

For 3-D integrated circuit design, a 3-D technology file should containinformation on how the vertically integrated device is to be assembled,as well as information on the fabrication processes for the individualcircuit levels. The wafers comprising the circuit levels in the stackmay all be fabricated in the same 2-D process, or they may each befabricated in a different process and have different materialsubstrates. FIG. 3 provides an illustration of a set of four wafers tobe diced and assembled into a 3-D circuit, in which two wafers arefabricated using a technology A and the other two fabricated using atechnology B.

The embodiment of the 3-D technology file structure disclosed below doesnot depend on how many 2-D sub-technologies are present. It also doesnot depend on any specific 3-D process methodology, whether based onmonolithic recrystallization, or on stacking and bonding circuits fromindependently fabricated wafers. For any process, the structure of a 3-Dintegrated circuit can be described by the depiction of FIG. 4 as asequence of circuit levels separated by bond layers. In some 3-Dintegration processes, the intervening bond layers may be absent orimplicit if no new material is added to join the circuit levels in the3-D stack. The details of how the circuit levels and bond layers areformed are embodied within the corresponding sections of the 3-Dtechnology file.

Referring to FIG. 5, there is diagrammatically illustrated the principalelements comprising an embodiment of a 3-D technology file structure ofthese teachings. A specific 3-D technology file need not containinformation in all of the sections depicted, and it may contain sectionsnot shown in the diagram, however it should contain a CircuitLevels/Technologies Section (510).

The Units Section (500) plays a similar role in the 3-D technology fileas it does in the 2D technology file. It should be recognized that thereis no requirement that all circuit levels comprising the 3-D integratedcircuit have the same minimum feature sizes. For example,micro-electro-mechanical (MEMS) circuit with a 2 micrometer minimumfeature size might be joined to a CMOS circuit with a 90 nanometerminimum feature size. The Units Section in the 3-D technology fileshould specify the units and resolution at which geometry is drawn forthe 3-D integration process.

The Circuit Levels/Technologies Section (510) defines each circuit leveland specifies the 2-D technology with which it is fabricated. FIG. 6 aillustrates diagrammatically the contents of this section in oneembodiment. Each circuit level is assigned a name and is associated withthe name of a 2-D technology file. This name will be used to index thematerials for each level. In a preferred embodiment of a CAD programutilizing the 3-D technology file, the names of each level would bestored in a list along with a pointer to a data structure containing theelements of the relevant 2-D technology file. This will enable each 2-Dsub-technology to be loaded only once into the main memory of a computerfor an automated design program and to be indexed by the circuit levelidentifier.

The Bond Layers Section (520) defines a structure containing thematerial layers that are formed between two circuit levels during the3-D assembly process. A bond layer need not be defined if the 3-Dprocess does not require one—for example, if the stack is formed bythermal compression of two circuit levels and no additional materialsare added. If, however, additional processing requires deposition of anoxide layer or additional metallization, the bond layer should bedefined to identify the geometries drawn for these features. FIG. 6 billustrates diagrammatically the contents of this section in a preferredembodiment. Each of the bond layers is defined and given a name. As withthe circuit level definitions, the bond layer identifier will serve asan index to distinguish the set of materials within the layer. In apreferred embodiment the ordering of the circuit levels and bond layersfollows the definition of both. A ‘Stack Order” instruction (620) liststhe circuit levels and bond layers by their identifiers in the order inwhich they appear in the 3-D integrated circuit. It also provides theopportunity to indicate whether the circuit level is inverted beforebeing placed on the stack. Other information may be added as well,including thicknesses of the bonding material. This information isuseful in extracting solid models of the 3-D circuit from the layoutdata. In other embodiments the stack order instruction may appear in adifferent section of the technology file.

The 3-D Layer Definition Section (530) is required if geometry is drawnfor materials added or formed during the 3-D assembly process and notduring the fabrication of the circuit levels. FIG. 6 c illustratesdiagrammatically some statements present in this section for oneembodiment of a 3-D technology file. The syntax (630), indicated incomments above the statements defining the layers, is similar to thatwhich might be found in a 2-D technology file. The name of the layer isgiven along with the names of a set of style patterns with which thelayer will be rendered on a computer monitor. In addition, for the 3-Dtechnology file, the bond layer in which the material layer is formed isidentified to associate the material with a particular physical locationin the 3-D integrated circuit.

The 3-D Design Rules Section (540) provides a set of rules specific tothe 3-D assembly process that concern the 3-D layers and anyrequirements for vertical alignment of circuits on different levels.FIG. 6 d illustrates diagrammatically some statements present in thissection for one embodiment of a 3-D technology file. The width rule(640) defines the minimum width, in the units defined in the UnitsSection, for the named 3-D material layer, previously defined in the 3-DLayer Definition Section. The spacing rule (650) defines the minimumspacing between a 3-D material layer and a group of layers found on thecircuit level identified by ‘L2’. The 2-D material layers thusdesignated will have been defined in the 2-D technology data structurepointed to by the circuit level identifier. In drawing geometry for a3-D cell, an error will be raised if a shape of the named 3-D materiallayer is drawn within the minimum spacing to the 2-D materials on thenamed level, but not on any other level, unless rules are added forthese other levels. The 3-D Design Rules Section may contain rules forgeometric constraints other than width and spacing, and these mayconcern any combination of 3-D material layers and 2-D materials ondifferent levels.

The 3-D Electrical Rules Section (550) defines the interconnectmethodology for connecting different circuit levels. This section maydefine the connectivity of 3-D vias, or it may define connectivitybetween materials on individual circuit levels defined in the 2-Dtechnology that connect when the levels are stacked and joined together.FIG. 6 e illustrates diagrammatically some statements present in thissection for one embodiment of a 3-D technology file. The statementsillustrated specify that the shapes of the named layers in the list willconnect electrically when they touch or overlap. The layers may bedefined either in the 3-D technology file or in one of the 2-Dsub-technologies. In the latter case, the circuit level identifiershould be present with the layer name. Any other types of statementsusually appearing in the Electrical Rules Section of a 2-D technologyfile may also appear in this section for the 3-D technology file.

The 3-D Mask Output Rules Section (560) specifies how to map shapesdrawn on the 3-D design layers to shapes on physical mask layers. Themapping rules will be similar to those found in the Mask Output RulesSection of any 2-D technology file.

In one embodiment, shown in FIG. 6 f, the 3-D technology file of theseteachings is obtained by providing 512 an identifier for two or morecircuit levels, providing 522, for each one of the two or more circuitlevels, an identifier for a 2-D technology file corresponding to each ofthe one are more circuit levels and providing 532 a file structureincluding the two or more circuit levels and each identifier,corresponding to each one of the to a more circuit levels, for the 2-Dtechnology file corresponding to each one of the two or more circuitfails. In one instance, the identifier for each 2-D technology file is apointer to the 2-D technology file. In another embodiment, the method ofobtaining the 3-D technology file of these teachings also includesproviding 542 an identifier for the bond layer disposed between two ofthe circuit levels. In another instance, a list is provided 552, wherethe list includes the two or more circuit level identifiers and theidentifier for each bond layer, the identifiers being listed in theorder in which the corresponding structures appear in the 3-D integratedcircuit. In another instance, one or more indicators are provided 562where the one or more indicators indicate whether one or more of thecircuit levels are inverted when located in the 3-D device. In otherinstances, design layer identifying information is provided for layersformed in assembly of the 3-D device, or rules are provided for 3-Dassembly, or physical design rules are provided for 3-D deviceintegration or rules are provided for generating physical masks for 3-Ddevice fabrication.

It should also be noted that the 3-D technology file of these teachingscan be obtained by use of a system, such as that shown in FIG. 6 g,including one or more processors 1620, a computer usable medium 1650including a data structure, where the data structure includes the abovedescribed file structure, and another computer usable medium 1630 (whichcould be the same as the first computer usable medium) having a computerreadable code embodied therein that causes the one or more processors toinput the data structure and input each 2-D technology filecorresponding to each one of the circuit levels. In one instance, eachof the 2-D technology files is inputted only once. In another instance,the system also includes a display 1640. The one or more processors1620, the computer usable medium 1650, the other computer usable medium1630 and the display 1640 are operatively connected by connection means1615, such as a computer bus in one embodiment or carrier signals inanother embodiment.

There are multiple advantages to defining a 3-D technology file in thehierarchical manner shown, as opposed to extending existing 2-Dtechnology files by replicating layers and rules. In summary, thedisclosed 3-D technology file structure permits:

In order to design a 3-D integrated circuit using current art methodsincorporating a 2-D technology file as described above, a set of uniquematerial layer names for each circuit level should be defined. Forexample, a technology file for a 3-D integration process comprisingthree levels, all fabricated in the same CMOS process, would need tohave layers polysilicon_(—)1, polysilicon 2, and polysilicon_(—)3;active_(—)1, active_(—)2, and active_(—)3, etc., in order todifferentiate artwork on level 1, 2, and 3. The CAD layout program usingthis file should understand that polysilicon_(—)2 interacts withactive_(—)2 and not activem1 to form a transistor. In addition, the 2-Ddesign and electrical rules pertaining to each material layer shouldalso be replicated, even though they are identical except for the suffixon the layer name. On the other hand, 3-D vias, and also 3-D designrules, should be defined between the correct drawing layers on thecorresponding levels. Whether the multi-layer technology file is createdby hand or automatically generated from the 2-D technology usingsoftware methods, the increased number of layers requires moreadministrative maintenance and is susceptible to errors introduced inthe process.

In the hierarchical structure of the 3-D technology file, only one datastructure is created for each 2-D technology file and loaded into thecomputer's main memory, regardless of how many times it is used ondifferent circuit levels. Furthermore, the data structures can be moreefficiently organized in a hierarchical manner than in a flattened, orlinear, manner, resulting in faster access times to retrieveinformation.

Foundries that offer 2-D wafer fabrication usually furnish design kitsto their users that include technology files and design libraries in theformats used by common CAD software for integrated circuit design. For3-D integration processes that assemble wafers fabricated in existingfoundries, a 3-D technology file can be created without any modificationto the 2-D files supplied by the foundry.

Because the material layers are not defined in reference to the circuitlevel on which they are drawn, previously defined 2-D layouts fromdesign libraries may be instantiated without modification on any circuitlevel fabricated with the appropriate technology.

There is no restriction on the number or types of different 2-Dprocesses that may be used to fabricate the circuit levels, or on thenumber of times the same process is used. It is possible to define a 3-Dprocess in which each circuit level is fabricated not only with adifferent technology, but with different semiconductor materials such asSilicon, Gallium Arsenide, or Silicon-Germanium.

Referring to FIG. 7, there is diagrammatically illustrated the generalstructure of a conventional 2-D hierarchical layout cell. Thehierarchical structure is composed of two parts: Drawn Geometry (700)and Child Sub-cells (750). The Drawn Geometry portion (710) may containany number of shapes, including none, of material layers. The ChildSub-cells portion (760) may contain any number, including none, ofinstances of 2-D hierarchical cells, also having components of drawngeometry and their own child sub-cells. A cell containing no childsub-cells is referred to as a “leaf’ cell. The depth of a child cell ina hierarchy refers to the number of parent cells in its lineage to thetop of the hierarchy. The child sub-cells (760) in FIG. 7 are atdepth 1. Their direct children, if any, are at depth 2 for thishierarchy, and so on.

Referring to FIG. 8, there is diagrammatically illustrated an embodimentof a 3-D hierarchical cell according to the present invention. As withthe prior art 2-D hierarchical structure, the 3-D hierarchical cell isalso partitioned into Drawn Geometry (800) and Child Sub-cells (850)portions. Unlike the 2-D cell, the 3-D cell may contain geometry for 3-Ddesign layers and for 2-D design layers on each of its circuit levels.To simplify the illustration, the 3-D structure shown in FIG. 8 has twocircuit levels, CL1 and CL2, however it should be clear from thediscussion that the structure described can be extended to having anynumber of circuit levels.

In order to avoid excessive numbers of indices associated with eachmaterial shape in the 3-D layout cell, it is preferable to implement theDrawn Geometry segment as a data structure in which a root elementpoints to substructures for each circuit level, each of which in turnpoints to its own data structure containing the material geometry. FIG.9 illustrates diagrammatically one embodiment of such a data structure.The root element (800) points to elements (810), (820) and (830), eachof which is a data structure containing a list of geometric shapes. Thestructure of the list of shapes may be that of a linked list, abin-based array, a set of corner-stitched planes, or any of a variety ofdata structures well known to those skilled in the art of algorithmicdesign for automated integrated circuit layout.

It is noted that, whereas each circuit level is assigned its own datastructure, only one data structure is defined for 3-D material layers.In one embodiment, the 3-D materials are grouped into one structurealthough they may be on different bond layers. This is done forsimplicity because the 3-D technology file provides all information touniquely identify each 3-D material layer. It can readily be envisioned,however, an application in which it is desirable to implement thematerial shapes for each bond layer in a separate data structure. Theembodiments disclosed herein should not be construed as limiting thispossibility.

In the Child Sub-cells (850) segment of FIG. 8, the child sub-cells inthe 3-D hierarchical structure are also distinguished as being 3-D (860)or 2-D children, the latter being grouped by circuit level (870) and(880). The number of child cells shown in the diagram in each group isfor illustrative purposes only, and does not imply a limit on the numberof child sub-cells of any type that may be included in theimplementation of any 3-D hierarchical cell. The 3-D child cells (865)are also organized according to the general 3-D hierarchical structuredepicted in FIG. 8. In one embodiment, each child sub-cell instance willcontain a pointer to a data structure identifying the circuit level towhich it is assigned. In another embodiment, the 3-D Child Sub-cells(850) segment may be organized in a similar fashion to the methoddepicted in FIG. 9 for the 3-D Drawn Geometry segment. In such anembodiment, a root data structure would contain a data structurepointing to a list of 3-D children and a data structure for each of the2-D circuit levels pointing to a list of 2-D children for the givenlevel.

In one embodiment, the 3-D cell structure of these teachings is a 3-Dcell data structure including a root data structure having a root nodedata object, the root node data object identifying a 3-D structure and anumber of branch reference data objects. The 3-D cell data structurealso includes a number of branch data structures, each branch datastructure including a data object identified one distinct circuit levelfrom a number of circuit levels and a reference data object providing apointer to a another data structure, where the other data structureincludes a list of geometric shapes corresponding to the one distinctcircuit level. The 3-D cell data structure also includes each branchreference data object from a number of branch reference data objects,where each branch reference data object provides a pointer to one branchdata structure from a number of branch data structures. The number ofcircuit levels includes at least one 3-D design layer.

A 2-D hierarchical cell can be represented by a directed acyclic graph,or tree, in which the root cell has branches to child cells, each ofwhich in turn may have branches to other child cells. The treeterminates at leaf cells, which have no branches. No cell in the treemay have a child that is also a member of its ancestral lineage to theroot, as otherwise the graph would contain a cycle. Each cell in thetree represents a specific, distinct entity stored in the designdatabase of the automated CAD program.

The 2-D hierarchical tree structure, which is the foundation ofconventional automated CAD programs for integrated circuit design, posesmany practical problems for 3-D hierarchical design, however. To explainan example problematic case, reference is made to FIG. 10, in whichthere is diagrammatically illustrated a unit 3-D cell (1000) havingdrawn geometry on three circuit levels and representing a basicfunctional component of a larger circuit. This unit cell might be aportion of a 3-D integrated imaging circuit, in which one circuit levelcontains a photoreceptor, one level contains an analog-to-digitalconversion circuit, and one level contains a digital processing circuit.Alternatively, the unit cell might be a 3-D integratedprocessor-in-memory circuit, in which one circuit level contains a groupof charge storage cells, another level contains a processing element,and a third circuit level contains logic for reading from and writing tothe cell. There is no limit to the number of possibilities that may beenvisioned for the function embodied by the unit cell, or to the numberof circuit levels that it contains. The central feature is that thecombination of interconnected circuit levels forms a functionalcomponent that should be designed and verified as a single entity. Afterthe unit 3-D cell is created in the design database, a largerhierarchical cell (1010), comprising some number of these unit cells, isbuilt to form a core 3-D logic block.

FIG. 11 illustrates a sequence of design steps that would be followed inthe example case to create a complete 3-D integrated circuit comprisingthe 3-D core logic block along with other 2-D cells required to drivecircuits on one circuit level. Step 1 entails the design of thethree-level unit cell, which is given the name ‘ucell3D’ in thedatabase. Step 2 entails the creation of the core 3-D logic block, whichis given the name ‘core3D’ in the database. In the next step, Step 3,the designer creates a 2-D logic cell specific to a particular circuitlevel. Such a cell might be a pre-charge circuit to initialize a memorycircuit, or it might be a clock driver circuit to distribute signals onone circuit level, or it might embody any of an unlimited number ofother functions. The central feature of the putative cell is that itinteracts directly only with other cells on its same circuit level. Forpurposes of the example, this cell is said to represent a clock drivercircuit (1100) for circuit level 2 of the complete 3-D integratedcircuit, and is given the name ‘clk2D’ in the database. In Step 4 thedesigner creates an array of these clock driver cells to serve as thespine connecting to, and driving the components of, the core logic blockon circuit level 2. This array (1110), which is a 2-D hierarchical cell,is given the name ‘spineCL2’ in the database. The contents of the designdatabase at the end of Step 4 are listed at the bottom of FIG. 11.

The problem situation occurs when the designer reaches Step 5, in whichthe operation of the clock driver spine should be verified inconjunction with the core logic components on circuit level 2. It shouldbe noted that there is no cell in the database containing only thecircuit level 2 components of the core logic. The designer could createa 3-D hierarchical cell containing an instance of the 2-D array‘spineCL2’ and an instance of the 3-D core ‘core3D’. However, it wouldthen be necessary to test all of the circuit levels at once, which wouldrequire considerably more time and resources than testing only thecircuit level 2 functions. In order to proceed with the verification,the designer should have an efficient method to isolate the componentsspecific to this particular slice of the 3-D circuit.

Using existing automated design tools, the designer should follow asequence of steps similar to those depicted diagrammatically in FIG. 12.Step 5 a entails the creation of a new 2-D cell containing a copy of thecircuit level 2 geometry of the initial unit 3-D cell ‘ucell3D’. This2-D cell is given the name ‘ucellCL2’ in the database. Step 5 b entailsthe creation of a new 2-D core logic block containing some number ofinstances of the unit 2-D cell ‘ucellCL2’. The 2-D core logic block isgiven the name ‘coreCL2’ in the database and represents the image of the3-D logic core restricted to circuit level 2. In Step 5 c, the designercreates a 2-D hierarchical cell, given the name ‘clkdcore2D’, containingan instance of the clock driver spine (1110), ‘spineCL2’, and aninstance of the circuit level 2 core logic cell, ‘coreCL2’. In Step 5 d,the designer proceeds with the verification procedures on the‘clkdcore2II cell. The contents of the design database at the end ofthis sequence of steps are listed at the bottom of FIG. 12. It should benoted that the entries ‘ucell3D’ and ‘ucel1CL2’ contain duplicateinformation, as do the entries ‘core3D’ and ‘coreCL2’. If errors arediscovered in the verification process, each copy of the duplicatedinformation should be updated.

An embodiment of the present invention teaches an alternative, moreefficient method for organizing a 3-D hierarchical tree that does notrequire additional entries in the database, and thus provides greatersimplicity in maintaining its integrity. The new method requires thatone be able to reference the projection of a 3-D cell onto a singlecircuit level by direct reference to the original 3-D cell as explainedbelow.

The term “circuit level projection” used herein denotes a 2-Dhierarchical cell comprising all elements of a 3-D cell for a singlecircuit level at the same depth of hierarchy as in the original cell.Referring to FIG. 13, there is diagrammatically illustrated theprojection of the 3-D hierarchical cell structure of FIG. 8 onto its CL1circuit level. The Drawn Geometry segment (1300) of the resulting 2-Dcell points to the same data structure containing the CL1 layer geometry(820) of the 3-D cell. Any changes made to this geometry will thus bereflected in both the 3-D and the projected 2-D cell views. The Childsub-cells segment (1350) of the projected 2-D cell contains pointers tothe same 2-D child cells (875) instantiated for circuit level CL1 in the3-D cell. The 3-D child sub-cells (865) of the originating 3-D cell donot appear directly as children. Instead, their 2-D projections onto CL1(1360) are referenced as child sub-cells of the projected 2-D cell.

It can be readily seen that the structure of the 3-D hierarchical cellas defined herein above provides a means to efficiently address acircuit level projection by reference to the 3-D cell. It is necessaryonly to add a set of pointers that address the drawn geometry and thechild sub-cells by level. The circuit level projections of the 3-D childsub-cells are referenced recursively in the same manner as for theparent. In other words, each of the projected 3-D child sub-cells (1360)references a separate 2-D layout cell having substantially the samestructure depicted in FIG. 13 for the parent.

Referring to FIG. 14, there are diagrammatically illustrated the 2-Dprojections of the 3-D hierarchical structure (1010), representing thecore 3-D logic block of the example design onto each circuit level CL1(1400), CL2 (1410) and CL3 (1420). Having thus augmented the 3-D celldata structure with a means to reference each circuit level projection,the procedure to verify the circuit level 2 logic of the example designproblem is greatly simplified. FIG. 15 diagrammatically depicts thesteps of the procedure according to the current invention. In the newStep 5 a, the designer creates a 2-D hierarchical cell (1500), given thename ‘clkdcore2D’, containing an instance of the clock driver spine(1110), ‘spineCL2’, and an instance of the circuit level 2 projection(1410) of the core 3-D block. In the new Step 5 b, the designer proceedswith the verification procedures on the ‘clkdcore2D’ cell in the samemanner as in the prior art Step 5 d procedure. It is noted that no cellscontaining duplicate information are created in the database followingthe new procedure.

Referring to FIGS. 16 a and 16 b, there are diagrammatically illustratedtwo embodiments of a 3-D hierarchical tree structure representing thetop-level 3-D integrated circuit containing both the core 3-D logicblock and the 2-D clock driver core for circuit level 2 as child cellsin the tree. In FIG. 16 a, the child cells ‘clkdcore2D’ (1500) and‘core3D’ (1010) are siblings because they are at the same depth from theroot. In FIG. 16 b, the ‘clkdcore2D’ cell (1500) is a child of the‘core3D’ cell (1010) although the former has a child sub-cell that is aprojection of the latter. This arrangement does not create a cyclicreference because the projection (1410) is not a parent or otherancestor of the 2-D ‘clkdcore2D’ cell (1500).

It is noted that once a circuit level projection of a 3-D cell isinstantiated within a 2-D cell, the 2-D cell cannot thereafter beinstantiated as a child of a 3-D parent at a different level.

In one embodiment, the method of these teachings for defining a datastructure includes providing a number of data objects (a first group ofdata objects) stored in a computer usable medium, where each data objectidentifies one circuit level from a number of circuit levels, andproviding a corresponding reference data object for each data object,where the corresponding reference data object provides a pointer to adata structure including a list of geometric shapes, where the number ofcircuit levels includes at least one 3-D design layer. In one instance,the method also includes providing a second group of data objects, whereeach data object from the second group of data objects identifies of asa child cell, and providing a second group of corresponding referencedata object for each one of the data objects from the second group ofdata objects, where each corresponding reference data object from thesecond group of corresponding data objects provides a pointer to onedata object from the first group of data objects. The pointer to thedata object identifies a circuit level. The child cell identified by thedata object from the second group is assigned to that circuit levelidentified by the data object from the first group. In one instance, asingle data object from the first group of data objects is provided for3-D material layers.

In another embodiment, the method includes providing a secondcorresponding reference data object for each data object from the firstgroup of data objects, where the second corresponding reference dataobject provides a pointer to a data structure, the data structureincluding a list of child cells, wherein one list of child cells is alist of 3-D child cells. In one instance, the method also includesproviding a circuit level projection of a 3-D child cell onto a circuitlevel and including an identifier for this circuit level projection inthe list of child cells, where the list of child cells is referenced bythe second corresponding reference data object. In another instance, themethod includes providing a circuit level projection of a 3-D child cellonto a selected circuit level, providing a data object of a third groupof other data objects, where the data object of a third group of otherdata objects identifies the circuit level projection of a 3-D childcell, and providing another corresponding reference data object for thedata object of a third group of other data objects, the othercorresponding reference data object providing a pointer to the dataobject from first group of data objects, the pointer pointing to the onedata object identifying the selected circuit level.

Having implemented the methods and systems relevant to creating the datastructures seen thus far for the 3-D technology file and for the 3-Dhierarchical cell and tree organizations, the methods for utilizingthese structures within a computer-aided integrated circuit designprogram are readily derived. The basic functions required for creatingmask artwork for a 3-D integrated circuit are (1) creating new layoutcells; (2) drawing geometry; and (3) instantiating child cells within aparent cell. Methods for performing these functions exist already inconventional 2-D integrated circuit layout CAD programs. Described beloware embodiments that augment conventional methods for the purpose ofimplementing a 3-D integrated circuit layout CAD program.

An embodiment of the method to create a new layout cell with a giventechnology, either the 3-D parent technology or one of the 2-Dsub-technologies, should be provided. One embodiment of this methodprovides an interactive menu to the user, such as the prototype menuillustrated in FIG. 17 a. By selecting the technology, the userautomatically identifies the cell as a 3-D cell or as a 2-D cell.

An embodiment of the method for selecting the circuit level should beadded within the drawing function when laying out geometry for a 3-Dcell. In one instance, this method provides an interactive menu to theuser, such as the prototype menu illustrated in FIG. 17 b. Once the 3-Dor the 2-D circuit level is selected, the user should be presented witha palette of drawing layers defined in the technology assigned to thegiven level. It is noted that this menu selection should be enabled onlyfor 3-D cell layout. 2-D cells are allowed to draw shapes only forlayers defined in their specific technology.

An embodiment of the method for adding child instances on a specifiedcircuit level should be added to permit 2-D child cells to beinstantiated within a parent 3-D cell. It is also necessary to add amethod that permits instantiating a 2-D circuit level projection of a3-D cell within a 2-D parent. One embodiment of both methods provides aninteractive menu to the user, such as the prototype menu illustrated inFIG. 17 c. It is noted that these embodiments are not required toinstantiate a 3-D child within a 3-D parent, or to instantiate a 2-Dchild within a 2-D parent. Existing methods suffice for these latterfunctions.

As detailed above, in one embodiment, the method of these teachings forlayout for a 3-D integrated circuit includes identifying adimensionality of a cell and selecting a circuit level for a 3-D cell.In one instance, the method can include providing an instantiation of a2-D child cell within the 3-D cell. In another instance, the method canalso include providing an instantiation of a 2-D circuit levelprojection of a 3-D cell within a 2-D cell.

In one embodiment, the method of these teachings is performed via agraphical user interface in a computer system.

In one embodiment, a user interface of these teachings for identifying acell and a technology utilized in that cell in a layout of a 3-Dintegrated circuit includes a component capable of enabling input of acell name for a cell and a component capable of selecting a technologyfor said cell.

In another embodiment, a user interface of these teachings includes acomponent capable of selecting a circuit level for a 3-D cell.

“Component” as used herein refers to means for selecting options ingraphical user interfaces (GUIs) such as, but not limited to, menus,pull down menus, drag and drop between dialog boxes, and other selectingmeans (see, for example, C. Petzold, Programming Windows, ISBN1-57231-995-X, Ch. 9, Ch. 10, Ch. 11, pp. 357-566).

In one instance, a computer readable code causes one or more processorsto implement the user interface of these teachings.

In one embodiment, a system for layout for a 3-D integrated circuit,similar to the system shown in FIG. 6 g, includes one or moreprocessors, a display and a computer usable medium having a computerreadable code embodied therein that causes the one or more processors toimplement a user interface of these teachings.

Automated design programs for 3-D integrated circuit layout will havethe same requirements as those for 2-D integrated circuit layout forverifying correctness of the layout. Methods for performingverifications such as physical design rule checking and netlistextraction and comparison are well established in the current art of 2-Dcircuit design automation. The 3-D technology file structure providesthe means to define rules for electrical and physical interactionsbetween geometries for 3-D design layers and 2-D design layers onspecific circuit levels. The 3-D hierarchical tree organization providesthe means to traverse the design hierarchy laterally, on the samecircuit level, or vertically across circuit levels. It should be notedthat existing 2-D verification methods may be readily extended to 3-Dintegrated circuit design using the methods disclosed in this inventionby appropriate reference to the 3-D data structures.

Each computer program may be implemented in any programming language,such as assembly language, machine language, a high-level proceduralprogramming language, an object-oriented programming language, or acombination thereof. The programming language may be a compiled orinterpreted programming language.

Each computer program may be implemented in a computer program producttangibly embodied in a computer-readable storage device for execution bya computer processor. Method steps of the invention may be performed bya computer processor executing a program tangibly embodied on acomputer-readable medium to perform functions of the invention byoperating on input and generating output.

Common forms of computer-readable (computer usable) media include, forexample, a floppy disk, a flexible disk, hard disk, magnetic tape, orany other magnetic medium, a CDROM, any other optical medium, punchedcards, paper tape, any other physical medium with patterns of holes orother patterns, a RAM, a PROM, and EPROM, a FLASH-EPROM, any othermemory chip or cartridge, a carrier wave, such as electromagneticradiation or electrical signals, or any other medium from which acomputer can read.

Although the invention has been described with respect to variousembodiments, it should be realized this invention is also capable of awide variety of further and other embodiments within the spirit andscope of the appended claims.

What is claimed is:
 1. A method for defining a 3-D technology filestructure in a computer system for designing a semiconductor device, themethod comprising the steps of: providing in the computer system a firstcircuit level identifier for a first circuit level in a semiconductordevice comprising multiple levels of semiconductor substrates; providingin the computer system a second circuit level identifier for a secondcircuit level in the semiconductor device comprising multiple levels ofsemiconductor substrates; providing in the computer system a first 2-Dtechnology file identifier for a 2-D technology file containingtechnology dependent information corresponding to the first circuitlevel in the semiconductor device comprising multiple levels ofsemiconductor substrates; providing in the computer system a second 2-Dtechnology file identifier for a 2-D technology file containingtechnology dependent information corresponding to the second circuitlevel in the semiconductor device comprising multiple levels ofsemiconductor substrates; and creating, in the computer system, a filestructure configured for use in generating a layout of the semiconductordevice comprising multiple levels of semiconductor substrates, the filestructure comprising the first circuit level identifier, the first 2-Dtechnology file identifier, the second circuit level identifier and thesecond 2-D technology file identifier.
 2. The method of claim 1, whereinthe 2-D technology file identifier comprises a pointer to the 2-Dtechnology file.
 3. The method of claim 1 further comprising a step ofassigning a 2-D technology to each of the first circuit level and thesecond circuit level.
 4. The method of claim 1, wherein the 2-Dtechnology file comprises a pre-existing 2-D technology file.
 5. Themethod of claim 1, further comprising a step of providing an identifierfor a bond layer disposed between the first circuit level and the secondcircuit level.
 6. The method of claim 5 further comprising a step ofproviding a list comprising the first circuit level identifier, thesecond circuit level identifier and the identifier for the bond layer;the first circuit level identifier, the second circuit level identifierand the identifier for the bond layer being located in an order in whichthe first circuit level, the second circuit level and the bond layer arelocated in the semiconductor device comprising multiple levels ofsemiconductor substrates.
 7. The method of claim 6, further comprising astep of generating, in the computer system, a 3-D integrated circuitlayout for the semiconductor device comprising multiple levels ofsemiconductor substrates in accordance with the list.
 8. The method ofclaim 1, further comprising a step of verifying a 3-D integrated circuitlayout for the semiconductor device comprising multiple levels ofsemiconductor substrates in accordance with the file structure.
 9. Themethod of claim 1 wherein in at least one of the steps of providing inthe computer system the first circuit level identifier for the firstcircuit level, and the step of providing in the computer system a secondcircuit level identifier for a second circuit level in the semiconductordevice comprising multiple levels of semiconductor substrates involvesat least one of the first circuit level or the second circuit levelhaving active devices.
 10. The method of claim 1 wherein the filestructure is configured for use in verifying a 3-D integrated circuitlayout.
 11. The method of claim 1 wherein the multiple levels ofsemiconductor substrates are vertically stacked.
 12. A systemcomprising: at least one processor; a computer usable medium for storingdata for access by computer readable code being executed on said atleast one processor, said computer usable medium comprising, a datastructure stored in said computer readable medium, said data structureincluding, a first circuit level identifier for a first circuit level ina semiconductor device comprising multiple levels of semiconductorsubstrates a second circuit level identifier for a second circuit levelin the semiconductor device comprising multiple levels of semiconductorsubstrates; a first 2-D technology file identifier for a 2-D technologyfile containing technology dependent information corresponding to thefirst circuit level in the semiconductor device comprising multiplelevels of semiconductor substrates; a second 2-D technology fileidentifier for a 2-D technology file containing technology dependentinformation corresponding to the second circuit level in thesemiconductor device comprising multiple levels of semiconductorsubstrates; and a file structure configured for use in generating alayout of the semiconductor device comprising multiple levels ofsemiconductor substrates, the file structure comprising the firstcircuit level identifier, the first 2-D technology file identifier, thesecond circuit level identifier and the second 2-D technology fileidentifier.
 13. The system of claim 12 wherein at least one of the first2-D technology file identifier and second 2-D technology file identifiercomprises a pointer to a respective 2-D technology file.
 14. The systemof claim 12 wherein at least one of the first 2-D technology fileidentifier and second 2-D technology file identifier comprises anidentifier for a bond layer disposed between the first circuit level andthe second circuit level.
 15. The system of claim 12 wherein the 2-Dtechnology file comprises a pre-existing 2-D technology file.
 16. Thesystem of claim 12 further comprising a list comprising the firstcircuit level identifier, the second circuit level identifier and theidentifier for the bond layer; the first circuit level identifier, thesecond circuit level identifier and the identifier for the bond layerbeing located in an order in which the first circuit level, the secondcircuit level and the bond layer are located in the semiconductor devicecomprising multiple levels of semiconductor substrates.
 17. The systemof claim 12 wherein the data structure stored in said computer readablemedium is used to develop a 3-D integrated circuit layout for thesemiconductor device comprising multiple levels of semiconductorsubstrates.
 18. The system of claim 12 wherein the data structure storedin the computer readable medium is used to verify a 3-D integratedcircuit layout.
 19. The system of claim 12 wherein at least one of thefirst circuit level identifier for the first circuit level, and thesecond circuit level identifier for a second circuit level in thesemiconductor device comprising multiple levels of semiconductorsubstrates involves at least one of the first circuit level or thesecond circuit level having active devices.
 20. The system of claim 12wherein the multiple levels of semiconductor substrates are verticallystacked.